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Diode laser |
LED |
LED Advantages |
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Thermal damage |
Light power |
Similar |
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Thermal power |
Similar |
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Chip size |
1*10mm |
7.5*7.5mm |
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Conclusion |
Similar total thermal power, LED has bigger heat dissipation are and smaller heat flow density. |
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Heat transfer patch |
Pass to the bottom and rear Average path is 1.5mm |
Pass to the bottom Average path is just 0.2mm |
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Conclusion |
LED has very short heat transfer path, lower thermal resistance and much higher efficiency of heat dissipation. |
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Mechanical damage |
Stress |
Rectangle, high length-width ratio. Under stress of thermal deformation and thermal fatigue, chips easily desoldering or broken in
pulsed working |
Square, 1:1 length-width ratio. Extra thin chip and large soldering area firmly but low stress. |
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Conclusion |
Because of chip structure, LED chip’s stress is smaller than diode laser |
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Optical damage |
Light power |
Similar |
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Light emitting area |
Size 0.01*0.1mm High brightness, foreign body pollution can cause light-emitting surface burned |
Size 5*5mm Brightness is just similar to normal LED lamp of flashlight, slight dust will not being ignited to burn the lighting
surface |
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Conclusion |
Because of surface emitting, the brightness of LED light emitting area is much smaller than diode laser. |
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Chain damage |
Not like diode laser, for LED chips, single area’s failure does not affect other emitting area |
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